: Compare Micron parts with competitors by entering at least five characters of a part number. 2. Part Numbering Guides (PDFs)
The package code consists of two letters indicating the physical casing, physical dimensions, material composition (lead-free vs. leaded), and ball grid array (BGA) layout. Because these change frequently across generations, consulting Micron's active packaging catalog is essential. Common examples include: : 78-ball FBGA (DDR4) VA : 96-ball FBGA (DDR4) HC : 78-ball FBGA (DDR5) 5. Speed Grades and Cycle Times
Our example ends in , meaning it uses Micron's E-die architecture . Decoding Micron NAND Flash Part Numbers
If you have a (DIMM) like MTA18ASF2G72AZ-3G2R , the rules change: micron memory part number decoder
Micron divides its part numbers into distinct fields. While the exact breakdown varies slightly between volatile memory (DRAM) and non-volatile memory (NAND Flash), the standard framework generally spans 12 to 19 characters. The typical sequence follows this logic:
Separated by a colon ( : ), the final letter represents the manufacturing generation (die shrink) of the silicon. : First generation silicon :E : Mature, optimized silicon generation :G : Advanced sub-node generation NAND Flash Part Number Breakdown
This three-character field is critical:
Most modern components follow this 20+ character structure:
This segment reveals the internal capacity and data organization of the chip or module. It is typically split into the total depth and the bit width:
Micron DRAM part numbers follow a strict, standardized nomenclature. While exact layouts can vary slightly between generations (DDR3, DDR4, DDR5, and LPDDR), a standard Micron commercial DRAM part number generally breaks down into the following fields: : Compare Micron parts with competitors by entering
Indicates the total capacity of the chip package (e.g., = 128 Gigabits, 1T = 1 Terabit). Keep in mind this is in gigabits, not gigabytes (8 Gigabits = 1 Gigabyte). 3. Device Configuration (08)
Micron's NAND Flash and Solid-State Drives use a similar alphanumeric matrix, though the variables focus heavily on storage cells and interface protocols. [MT] [FD] [DA] [K] [1T0] [TBD] - [1A] [1] [2] [AZ] [YY]
Micron Technology is a global leader in semiconductor systems, producing vast quantities of DRAM, NAND flash, and solid-state storage. If you have ever looked at a Micron memory module or chip, you have likely seen a complex string of alphanumeric characters printed on the surface. leaded), and ball grid array (BGA) layout
If you have a specific code you are trying to read, tell me the or the 5-digit chip marking , and I will break down its precise specifications for you. Share public link